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| EMIF02-USB02F2 2-line IPADTM, EMI filter with ESD protection Features 2-line low-pass filter + ESD protection High efficiency in EMI filtering Lead-free package Very low PCB space occupation < 3.2 mm2 Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Pin layout (bump side) 4 3 VCC Flip Chip (10 bumps) 2 1 I6 A B Complies with the following standards: I4 O2 I3 O1 I5 I2 GND I1 IEC 61000-4-2 - 15 kV (air discharge) - 8 kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3 Figure 2. I6 I5 I4 D1 C D E Application EMI filtering and ESD protection for USB port. Basic cell configuration VCC R3 1.3k R2 33 I2 O2 Description The EMIF02-USB02F2 is a highly integrated array designed to suppress EMI / RFI noise for a USB port. The EMIF02-USB02F2 Flip Chip packaging means the package size is equal to the die size. Additionally, this filter includes ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV. R4 10k I3 25pF 25pF GND 25pF 25pF R1 33 I1 O1 GND April 2008 Rev 2 1/7 www.st.com 7 Characteristics EMIF02-USB02F2 1 Characteristics Table 1. Symbol VPP Tj Top Tstg Absolute ratings (Tamb = 25 C) Parameter and test conditions ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge Junction temperature Operating temperature range Storage temperature range Value 15 8 125 - 40 to + 85 - 55 to + 150 Unit kV C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM Cline R1,R2 R3 R4 VF Electrical characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between input and output Input capacitance per line Test conditions IR = 1 mA VRM = 3V @ 0V Tolerance 5% Tolerance 5% Tolerance 5% @ 1 mA (D1 diode) 33 1.3 10 1 Min. 6 0.1 0.5 50 Typ. Max. Unit V A pF k k V IPP VCL VBR VRM IR IRM IRM IR VRM VBR VCL V I IPP 2/7 EMIF02-USB02F2 Characteristics Figure 3. 0.00 dB - 5.00 - 10.00 - 15.00 Attenuation measurement Figure 4. 0.00 dB Analog crosstalk measurement (I1- O2) - 10.00 - 20.00 - 30.00 - 20.00 - 40.00 - 25.00 - 30.00 - 35.00 - 40.00 - 45.00 - 50.00 100.0k 1.0M 10.0M f/Hz 100.0M 1.0G - 50.00 - 60.00 - 70.00 - 80.00 - 90.00 100.0k 1.0M 10.0M f/Hz 100.0M 1.0G Figure 5. ESD response to IEC 61000-4-2 (+15kV contact discharge) Figure 6. Line capacitance versus reverse applied voltage C(pF) 40 35 30 25 20 15 VR(V) 10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 3/7 Application information EMIF02-USB02F2 2 Application information Figure 7. Aplac model of D+ & D- cells C1 650 650 A3 0.8pF + + Csub rsub_1k3 + Csub rsub_1k3 + Csub + 0.8pF D2 bulk C1 or E1 16.5 16.5 C3 or E3 50pH Cbump I/O 0.8pF MODEL = D02_usb + + Csub rsub_33R + Csub rsub_33R + Csub + 0.8pF MODEL = D02_usb + Rbump bulk 50m 100m D2 MODEL = D02_usb MODEL = D02_5p MODEL = D02_5p MODEL = D02_usb bulk Lhole Rsub_D Rsub_D 100m D2 bulk D2 Figure 8. Aplac model parameters Cz 17pF opt Ls 0.4nH Rs 0.1 Rsub_D 10 Csub 0.3pF Rsub_33R 16 Rsub_1k3 18 lhole 170pH opt Cbump 1.2pF opt Rbump 350 D02_usb diodes model + BV = 7 + IBV = 1m + CJO = Cz + M = 0.3333 + RS = 2 + VJ = 0.6 + TT = 100n D02_5p diodes model + BV = 100 + IBV = 1m + CJO = 5p + M = 0.3333 + RS = 2 + VJ = 0.6 + TT = 100n 3 Ordering information scheme Figure 9. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x 2: Lead free, pitch = 500 m, bump = 315 m yy - xxx zz Fx 4/7 EMIF02-USB02F2 Package information 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 10. Flip Chip package dimensions 700m 50 315m 50 650m 65 495m 50 495m 50 285 m 1.62mm 50m Figure 11. Footprint recommendations Copper pad Diameter: 250 m recommended, 300 m max. Solder stencil opening: 330 m recommended Figure 12. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) 285 m 1.97mm 50m E Solder mask opening recommendation: 340 m min. for 300 m copper pad diameter xxz y ww 5/7 Ordering Information Figure 13. Flip Chip tape and reel specification Dot identifying Pin A1 location 4 0.1 O 1.5 0.1 EMIF02-USB02F2 1.75 0.1 3.5 0.1 2.07 0.73 0.05 All dimensions in mm 8 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 0.1 1.72 Note: More information is available in the application notes: AN1235: "Flip Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 5 Ordering Information Table 3. Ordering information Marking FG Package Flip Chip Weight 4.25 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF02-USB02F2 6 Revision history Table 4. Date 14-Dec-2004 Document revision history Revision 1 Changes First issue Updated ECOPACK statement. Updated Figure 9, Figure 10, Figure 12, and Figure 13. Reformatted to current standards. 28-Apr-2008 2 6/7 EMIF02-USB02F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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